SMT007 Magazine

SMT007-Oct2020

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OCTOBER 2020 I SMT007 MAGAZINE 35 Figure 2: DARPA's DAHI program has produced increasingly sophisticated multi-project wafers (MPWs) with compound semiconductor devices integrated on a CMOS silicon interposer [2] . Figure 3: DARPA's CHIPS program envisions a chiplet ecosystem that simplifies heterogeneous integration [3] .

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