Issue link: https://iconnect007.uberflip.com/i/1293772
OCTOBER 2020 I SMT007 MAGAZINE 35 Figure 2: DARPA's DAHI program has produced increasingly sophisticated multi-project wafers (MPWs) with compound semiconductor devices integrated on a CMOS silicon interposer [2] . Figure 3: DARPA's CHIPS program envisions a chiplet ecosystem that simplifies heterogeneous integration [3] .