Issue link: https://iconnect007.uberflip.com/i/1299286
OCTOBER 2020 I PCB007 MAGAZINE 9 search on plating issues that have a direct tie to the fabrication demands that heterogeneous in- tegration will ultimately bring to the industry. Pete Starkey talks with Taiyo's Don Monn. George Milad posts a discussion on plating pre- treatment. Todd Kolmodin and Michael Carano post their columns, and Marc Carter shares an article on reliability. Graham Naisbitt consid- ers IPC standards development, and Dan Fein- berg charts the changing velocities in technol- ogy innovation. This issue's thoughtful, pragmatic, and sometimes philosophical take on roadmap- ping—combined with our discussion of the topic in the October issues of SMT007 Magazine and Design007 Magazine—concludes our roadmap coverage. As always, we welcome your suggestions, comments, and ideas. I-Connect007's mission is to publish content that advances the conversations in our indus- try; if you're talking about it, we want to cover it, so let us know. PCB007 Nolan Johnson is managing editor of PCB007 Magazine. Nolan brings 30 years of career experience focused almost entirely on electronics design and manufacturing. To contact Johnson, click here. I recently saw this in action. The I-Con- nect007 team recently finished covering the SMTA International conference and tradeshow in its 2020 virtual format. Hats off to the SMTA staff for their perseverance and can-do attitude in choosing to hold SMTAI as a virtual confer- ence and exposition. The pandemic changed the landscape under all of us. SMTA responded by making a new roadmap rather than abandoning the event altogeth- er. Similar to Columbus, the SMTA crew con- sciously chose to go into new, uncharted ter- ritory to deliver on their original objective, no matter the challenges. This changed the road- maps for virtually every individual and compa- ny participating in the event. Ours was a very different worldview in the virtual tradeshow environment. In this issue, we conclude our three-part in- terview with Rita Horner on the significance of the IEEE's Heterogeneous Integration Road- map. MacDermid Alpha weighs in with an arti- cle that considers the impact heterogeneous in- tegration will have on substrate metallization, and Dr. John Mitchell's column ponders "Nav- igating Around the Future." We also talk to a fabricator—Sunstone Cir- cuits—about how they use roadmapping for strategic planning, and we share technical re-