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64 SMT007 MAGAZINE I JANUARY 2021 Henkel joins The Climate Pledge by Amazon and Global Optimism E Henkel reinforces its commitment to climate protection and joins The Climate Pledge, an international cross-industry commitment co- founded by Amazon and Global Optimism. As a signatory, Henkel commits to achieve net- zero annual carbon emissions 10 years ahead of the 2050 target set by the UN Paris Agree- ment—an ambition in line with the company's long-term target to become a climate-positive company by 2040. The Test Connection's Bill Horner Remembered E Bill Horner, the founder of The Test Connection Inc. and a well-respected engineer, passed away on September 21, 2020. He was 81 years old. Mycronic Partners with Cogiscan to Provide Machine Connectivity for Industry 4.0 Applications E Mycronic, the leading Swedish high-tech com- pany providing flexible production solutions to the electronics manufacturing industry, announces a new strategic partnership with Cogiscan Inc., supplier of Track Trace and Con- trol (TTC) and IIoT solutions, to provide machine connectivity for Industry 4.0 applications. Amtech Reports Record Sales for Advanced Packaging Reflow Systems E Amtech Systems, Inc., a manufacturer of cap- ital equipment, including thermal processing and wafer polishing, and related consumables, announced that its subsidiary, BTU Interna- tional, Inc., achieved record sales for its PYRA- MAX™ reflow systems sold into advanced packaging applications in fiscal year ending September 30, 2020. PDF Solutions to Acquire Cimetrix E PDF Solutions, Inc. announced it has entered into a definitive agreement to acquire Cime- trix Incorporated. The combination of Cime- trix® connectivity products and platforms with PDF Solutions' Exensio® analytics platform powered by machine learning, is intended to enable IC, assembly, and electronics manufac- turer customers to extract more intelligence– not just data—from their factory floor, to build more reliable ICs and systems at lower manu- facturing costs. MacDermid Alpha Releases HELIOFAB AG 7921 High-Brightness Silver for Leadframe Based LED Packages E MacDermid Alpha Electronics Solutions, a global leader in specialty materials for elec- tronics, announces the release of HELIOFAB AG 7921, a high brightness silver electroplat- ing process for leadframe based LED pack- ages. Indium Corporation's Proven Jetting Paste Recommended by NSW Automation E Indium Corporation's newest jetting and microdispensing solder paste, Indium12.8HF, has been officially recommended by NSW Automation for use with their newest micro- fluid dispenser, SD1. Seika Machinery Announces Year-end Sale on Select Products E Seika Machinery, Inc., a leading provider of advanced machinery, materials and engi- neering services, announces its year-end sale on select products. Significant savings are available for McDry cabinets, Sawa portable handy cleaners and Sayaka PCB routers while stock lasts.

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