Issue link: https://iconnect007.uberflip.com/i/1323994
JANUARY 2021 I SMT007 MAGAZINE 51 Solder Paste Printing Inspection We used a solder paste inspection SPI machine to conduct a thorough solder paste inspection to evaluate the quality of the paste, and that the paste was printed correctly and without manufacturing faults. Solder paste volume was evaluated for process consistency, and or process influence. Low Temperature Cure Adhesive To conduct this test, we followed standard print recommendations by LED manufacturing for solder paste print. Note that glue perfor- mance is critical to accuracy results. Figure 10: LED placement locations. Figure 11: SPI data—solder paste volume evaluated for process consistency. Figure 12: Adhesive dispense test results.