Issue link: https://iconnect007.uberflip.com/i/1323994
JANUARY 2021 I SMT007 MAGAZINE 55 X-ray Image for Void Inspection Void Specification • All pads <25%, single pad <10% Results All samples meet voiding specification LED Cross-Section We conducted a SEM (scanning electron micro- scope) image analysis to look at both tilt and voiding under magnification. Results • Minimal to no effect on package tilt from adhesive positioning • Minimal voiding Conclusions • TAP offers a novel approach to high- accuracy placement of LED packages enabling a scalable production solution • TAP eliminates the inaccuracies of alternative solutions caused by part movement during a post-inspection (top-side only) pick process Figure 21: X-ray image. Figure 22: Cross-section under magnification.