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92 PCB007 MAGAZINE I JANUARY 2021 Figure 14: The details of the optical cabling and backplane consisting of 192 waveguides, fabricated as eight flex conductor sheets of 24 WGs, divided into four connectors with 48 waveguides each; the L-Links and the D-Links operating at 850 nm and 12.5 Gbps [13] . Figure 15: The details of the optical system IBM is working on Optochip, Optomodule and Optocard connected by the polymer waveguides [13] . 3D Assembly Techniques With these new optical components, new 3D assembly techniques are going to be required. Many optical components require micron- level tolerances to create the proper optical alignment. Key to these assembly capabili- ties will be the Z-axis plateau tolerances of the printed circuit. X-Y-angular alignment will be new kinematic mounts that provide micron- precise alignments.