Design007 Magazine

40 DESIGN007 MAGAZINE I FEBRUARY 2021 Feature by Matt Walsh SIEMENS DIGITAL INDUSTRIES SOFTWARE Electronics companies are always under great pressure to continually grow and inno- vate. In addition to navigating ever-accelerat- ing design cycles, they must also address and overcome generational complexities asso- ciated with their products, the underlying components they use, and the human capital accountable for delivering on time and on bud- get. Electronics firms can ill afford the time and resource inefficiencies associated with manu- ally correcting design errors, poor library data integrity, or other inconsistencies leading to missed deadlines or even costly re-spins. e quality of eCAD libraries—or, more specifically, the quality of the underlying logi- cal and physical models—plays a pivotal role in stemming the challenges of delivering a success- ful electronics product to market. In fact, the eCAD library affects every process from PCB layout to PCB manufacturing and assembly. e Siemens PartQuest cloud-based applica- tion is a gateway to a large collection of compo- nent technical content for electronics design. is addresses five critical factors relative to best-in-class PCB library solutions: 1. High-quality eCAD model content. 2. Symbol and footprint creation. 3. Library management. 4. Standards. 5. Integration with Xpedition and PADS Professional. In October 2020, Siemens released the Part- Quest Vault, consisting of eCAD models (sym- bols and footprints) for over 1 million parts. ese pre-made models are entirely created, validated, and maintained by Siemens. A rules engine consisting of validation logic and thou- sands of checks are run against model content to confirm construction correctness, which provides end-customers with peace-of-mind when using this content. Further, the Vault is parametrically or keyword searchable, which simplifies the identification of the precise part to meet a product design's requirements, and the Vault is expected to contain 100 million parts by the end of 1QCY21. Managing Footprints with Integrated EDA Tools

• Design007 Magazine — February 2021
• Feature Contents — Footprints and Library Management
• Additional Contents
• FLEX007 Contents
• Column — Footprints and Library Management
• Feature Interview — Best Practices: Footprint Design and CAD Library Management
• Column — Developing Panel Level Semiconductor Packaging
• Feature Interview — Footprint Design Techniques: Don't Trust Datasheets
• Short — Shell, c# AI, Baker Hughes, Microsoft Launch Open AI Energy Initiative
• Column — Avoiding 'Blushing' and 'Bubbling' in Conformal Coatings
• Short — How Unmanned Underwater Vehicles Could Become Easier to Detect
• Feature — Managing Footprints with Integrated EDA Tools
• PCB007 Highlights
• IPC APEX EXPO 2021 — Schedule at a Glance
• IPC APEX EXPO 2021 — Making the Most of a Virtual Event
• Short — Figure It Out: Closing the Gap Between College and Industry with PCEA
• Feature — A Library Management Cautionary Tale
• Column — Stackup Configurations to Mitigate Crosstalk
• Short — Brain-to-Brain Communication Demo Receives DARPA Funding
• Feature Column — Circuit Material Library Considerations
• MilAero007 Highlights
• Feature Column — Footprints—Small Steps with a Giant Impact
• Short — Robot Race: The World's Top 10 Automated Countries
• FLEX007 Feature Column — IC Package Footprints: Why So Many and How Many Is Enough?
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• FLEX007 Column — PCB Technologies We Need Now and Later
• FLEX007 Short — Siemens, MaRS to Accelerate Innovation for Startups in Development of Autonomous, Connected Vehicles
• Top 10 Editor Picks from PCBDesign007.com
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