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• Design007 Magazine — February 2021
• Feature Contents — Footprints and Library Management
• Additional Contents
• FLEX007 Contents
• Column — Footprints and Library Management
• Feature Interview — Best Practices: Footprint Design and CAD Library Management
• Column — Developing Panel Level Semiconductor Packaging
• Feature Interview — Footprint Design Techniques: Don't Trust Datasheets
• Short — Shell, c# AI, Baker Hughes, Microsoft Launch Open AI Energy Initiative
• Column — Avoiding 'Blushing' and 'Bubbling' in Conformal Coatings
• Short — How Unmanned Underwater Vehicles Could Become Easier to Detect
• Feature — Managing Footprints with Integrated EDA Tools
• PCB007 Highlights
• IPC APEX EXPO 2021 — Schedule at a Glance
• IPC APEX EXPO 2021 — Making the Most of a Virtual Event
• Short — Figure It Out: Closing the Gap Between College and Industry with PCEA
• Feature — A Library Management Cautionary Tale
• Column — Stackup Configurations to Mitigate Crosstalk
• Short — Brain-to-Brain Communication Demo Receives DARPA Funding
• Feature Column — Circuit Material Library Considerations
• MilAero007 Highlights
• Feature Column — Footprints—Small Steps with a Giant Impact
• Short — Robot Race: The World's Top 10 Automated Countries
• FLEX007 Feature Column — IC Package Footprints: Why So Many and How Many Is Enough?
• FLEX007 Highlights
• FLEX007 Column — PCB Technologies We Need Now and Later
• FLEX007 Short — Siemens, MaRS to Accelerate Innovation for Startups in Development of Autonomous, Connected Vehicles
• Top 10 Editor Picks from PCBDesign007.com
• Career Opportunities Section
• I-007e Educational Resource Center
• Advertiser Index and Masthead
• I-Connect007 Subscription and Contact Information