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JULY 2021 I SMT007 MAGAZINE 79 the ALD coating were within the limits of the experimental error and therefore could not be measured in Figure 9 and therefore could not be plotted in Figure 10. can obtain the rates of copper corrosion as a function of temperature and plot them in an Arrhenius fashion as in Figure 10. e cor- rosion rates of copper and silver films under Figure 7: Uncorrected resistance of copper thin films as a function of time at various thin film temperatures in FoS chamber at 40°C and 15% relative humidity. The nominal thin film temperature was 42°C for 0–1.85 days; 52°C for 1.85–3 days; 64°C for 3–4.16 days and 42°C for 4.16–5.32 days. A) Silicone over copper thin film; b) ALD over copper thin film; c) bare copper thin film. Figure 8: Corrected resistance of copper thin films as a function of time in FoS chamber at 40°C and 15% relative humidity. The nominal thin film temperature was 42°C for 0–1.85 days; 52°C for 1.85–3 days; 64°C for 3–4.16 days and 42°C for 4.16–5.32 days. Figure 9: Extent of copper thin film corrosion as a function of time in FoS chamber at 40°C and 15% relative humidity. The nominal thin film temperature was 42°C for 0–1.85 days; 52°C for 1.85–3 days; 64°C for 3–4.16 days and 42°C for 4.16–5.32 days. a) a) a) b) b) b) c) c) c)