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PCB007-July2021

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82 PCB007 MAGAZINE I JULY 2021 The Government Circuit: Advocating for the Entire Electronics Supply Chain E Here in Washington, we are encouraged by re- cent policy discussions that indicate a biparti- san commitment to U.S. manufacturing that is long overdue. European officials are also pro- moting a policy agenda that could be very positive for electronics. But there is still more work to be done to bolster the entire electron- ics ecosystem. Adventures in Engineering: The Ecosystem of Autonomous Flight E To be clear, autonomous flight is here, it has been done, the achievement has been made. Now, how do we create an ecosystem for this newly proven technology and how do we in- corporate it into our lives? Germany Latest EU Country to Introduce Due Diligence Rules E On 11 June 2021, the German Supply Chain Act was adopted by the German Parliament by a large majority, introducing binding hu- man rights and environmental due diligence obligations for companies. Sypris Wins Electronic Warfare Program E Sypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc., announced that it has recent- ly received a full-rate production award from a U.S. DoD prime contractor to manufacture and test multiple electronic power supply modules for a large mission-critical U.S. Navy program. Production is expected to begin in the second half of 2021. Survey: Reasons U.S. Electronics Manu- facturers May Exit Defense Market E In a new IPC industry survey and report, 24% of electronics manufacturers say the costs and burdens of compliance with the Cybersecuri- ty Maturity Model Certification (CMMC) may force them out of the U.S. Department of De- fense's (DoD) supply chain. Raytheon Technologies Working to Take Heat Off New Generation of Fighters E e U.S. military has begun to define require- ments for its future fighters. To conduct oper- ations in advanced threat environments, next- gen fighters will need greater range provided by more powerful and fuel-efficient engines; better avionics; and advanced mission systems. EIPC Technical Snapshot Review: Microvia Reliability Issues E Since the mid-1990s, when they were devel- oped for mass production in the mobile phone industry, microvias have become principal enablers for high-density designs, and have evolved from single-level to complex stacked and staggered structures. ey are fundamen- tally robust interconnects, although some aspects of their reliability are still under inves- tigation. Defense Speak Interpreted: The U.S. Has a Space Force—JEDI Knights Next? E Does the U.S. Department of Defense's JEDI contract mean it's going into a Star Wars pro- duction? Sorry, no Stephen Spielberg this time. Sorting out the good guys and bad guys in this cloud computing scenario.

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