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AUGUST 2021 I PCB007 MAGAZINE 87 finishes like ENIG, ENEPIG, EPIG/EPAG, DIG, and ISIG to meet the designer's perfor- mance expectations. PCB007 George Milad is the national accounts manager for technology at Uyemura. To read past columns or contact Milad, click here. different layers is included, as well as perfor- mance criteria. Designers can call out the IPC specification in lieu of specifying thickness and performance. It is important to note here that designers have the option of taking exception with any parts of the specification. Such excep- tions are noted in the design drawings. All the finishes discussed here have big plus- es as well as certain limitations. All the finish- es are in use today. Hardly any have been obso- leted. Simpler board designs and performance expectations are readily met by simpler finish- es like HASL, I-Ag, I-Sn, and OSP. e more sophisticated designs require more complex Chapter 1: Data Center Infrastructure and Requirements Related to Electronics Systems System designers for 5G, automotive, high-per- formance computing (HPC), IoT, and other advanced applications have been facing growing challenges in EM interference and thermal issues. These are prevalent in all electronic devices. Data centers play a key role in this high-performance computing (HPC) era, and EMI/thermal issues have a huge impact on the performance of data centers. This book explains scenarios and issues based on the context of data center electronic systems. The design, implementation, quality, and reliabil- ity guidelines as defined by the American National Standards Institute (ANSI) and the Telecommunications Industry As- sociation (TIA) are critical consid- erations when developing lead- ing-edge data centers. They di- rectly translate into power, per- formance, area, integrity, and reliability requirements at every design and implementation stage of the electronic systems used to create the data center. Enterpris- es use data centers to house their business-critical applications and information from across the globe to aid better data management and security. The four main ele- ments for the functioning of a computing environ- ment are: • Compute: Memory, local storage, and processing power • Storage: Primary and backup storage devices Memory: • Random access memory (RAM) and cache • Networking: Equipment for connectivity ranging from routers and switches to controllers and firewalls The high-density data flow and processing in data centers pose thermal and EMI issues at various lev- els in its computing environment. Hence it is ex- tremely crucial to perform a thorough thermal/EMI analysis and optimization at the design level itself for every component at the individu- al as well as integrated level. Data Center Categories Data centers are classified into four main categories that serve dif- ferent purposes depending on fac- tors like destination, ownership, tech- nology, and other characteristics. To download this free eBook, published by I-Connect007, click here. To view the entire I-Connect007 eBook library, click here. Excerpt: The System Designer's Guide to… System Analysis, Chapter 1

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