PCB007 Magazine
PCB007-Aug2021
Issue link:
https://iconnect007.uberflip.com/i/1401769
Contents of this Issue
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Articles in this issue
PCB007 Magazine — August 2021
DFM: From the Fabricator Point of View
Additional Content
Column — DFM From the Fab Point of View
Feature Interview — A Fabricator's View of DFM Processes
Feature Article — Designing With the End in Mind—How the Meaning of DFM Will Transform in the Future
Feature Interview — DFM From the Fabricator's Point of View
Column — Leadership 101: The Laws of E.F. Hutton and Connection
Short — Wearable Brain-Machine Interface Turns Intentions Into Actions
Feature Article — Flex DFM: When All Things Must be Considered
Short — Researchers Uncover Unique Properties of a Promising New Superconductor
Article — Reasons and Solutions to PCB Lead Times and Price Increases
Electronics Industry News and Market Highlights
Feature Survey: The Readers Speak
Feature Article — Rigid-Flex Design Without Respins: A Webinar Review
Short — Putting a Strain on Semiconductors for Next-gen Chips
Column — Jumping the Technology Curve Collaboration With Your Competition
Short — Hire or Be Hired at jonConnect007
MilAero007 Highlights
Column — Holy Cow, What a Lead Time!
Short — Spen-sonics: Acoustic Wave Gets the Electrons Spinning
Column — Better by Design—Bringing PCB Design Professionals Together
Supplier Highlights
Column — Design for Manufacturing? Don't Forget Test!
Column — An Overview of Surface Finishes
Short — Excerpt: The System Designer's Guide to… System Analysis, Chapter 1
Feature Article — Ucamco Improves Communication With Gerber Job Editor Notes in Mandarin
Article — One Step/One Bath Copper Through-Hole Fill Pulse Plating Process Across Wide Range of Panel Dimensions
Short — Observatory in Chile Takes Highest-Resolution Measurements of Asteroid Surface Temperatures Ever Obtained From Earth
Top 10 Editor Picks from PCB007
Career Opportunities Section
Advertiser Index and Masthead
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