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102 DESIGN007 MAGAZINE I DECEMBER 2021 Columnist Ruben Contreras talks about producing high-tech PCBs from design to volume production, since it is within this area that customers often do not reach their initial targets regarding time, cost, and performance. During DesignCon, the I-Con- nect007 Editorial Team spoke with Mike Vinson and Paul Dennig of Averatek. They dis- cussed the company's latest advances in air cavities and semi-additive processes, and what this new technology will mean to the industry, especially PCB designers. Vinson said, "Over the next 12 months, I think you'll see more involvement from a number of areas— everything from sensors to the actual printed circuit boards themselves and miniaturization." Most electronic products today are assembled using the no-clean soldering process. The need for no-clean solder pastes emerged in response to legislation against the use of ozone-depleting chemicals, and the appeal of removing the costly flux cleaning operations in the assembly of PCBs. TOP TEN Fresh PCB Concepts: High-tech PCBs from Design to Volume Production Averatek Moves Ahead With A-SAP™, ASAP DownStream Adding More Flex, Rigid-Flex Functionality Nolan Johnson recently spoke with Joe Clark, one of the co-founders of DownStream Technologies. We discussed the company's latest software release, which adds more flex and rigid-flex capabilities, as well as updates to the scripting in DownStream's tools. As Joe explained, "With our current release of software, we focused on rigid-flex designs, which is becoming a common design challenge for our customers." Vinton & Denning Ruben Contreras Joe Clark EDITOR'S PICKS Beyond Design: The Impact of No-Clean Flux Residue on Signal Integrity

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