Issue link: https://iconnect007.uberflip.com/i/1453746
60 PCB007 MAGAZINE I FEBRUARY 2022 Multi-Chip Packages e current conventional flip-chip is a ball grid array package (Figure 2). e structure is one or two layers of the additive Ajinomoto build-up film (ABF) on a traditional high per- formance HDI core (1 + 2+ 1). New ABF pro- cesses utilize a high-temperature RCC (usu- ally polyimide) to permit higher temperature assembly processes 5 (Figure 3). Silicon Interposer e increasing complexity of HI will add more functionality to these substrates and result in interposer modules (Figure 4) that will contain IC chips of various materials/ connections, embedded components, RF/ antennas, optical waveguides, and even energy storage. Figure 2: Current double-sided molded ball grid array using ABF and high performance HDI. (Source: Semiconductor Engineering 4 ) Figure 3: New manufacturing process using ABF plus RCC. (Source: ABF Technical Report 5 )