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62 PCB007 MAGAZINE I FEBRUARY 2022 Challenges for PCB Fabs to Implement IC Packaging ere are around six to eight organic IC substrate fabricators in the world—all in Asia ( Japan, Taiwan, Korea, and Malaysia). Cur- rently, none are owned by China but that should change soon. All of these will migrate to making the HI substrates in high volume. If North America or the EU plan to manufacture the new HI substrates, several challenges will need to be overcome: • Material: ABF or similar films with their specialized vacuum lamination equipment and surface preparations for additive Cu will need to be mastered Table 1: The advantages and disadvantages of the three HI packages (Source: HIR Roadmap 6 ) Table 2: Geometries and characteristics of materials for alternative package substrates. (Source: HIR Roadmap 6 ) Figure 7: Frequency performance of the three packaging alternatives. (Source: HIR Roadmap 6 )