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124 I-CONNECT007 I REAL TIME WITH... IPC APEX EXPO 2022 SHOW & TELL MAGAZINE Presenter: Michael Schleicher, PCB Designer, SEMIKRON What is the most interesting question that your IPC APEX EXPO presenta- tion answers? How will a PCB made with additively manufactured substrates be designed in the future? What is your answer to that question, and why? To achieve the benefits of additively manufactured electronics (AME), a new way of thinking about design and new design tools are needed. The clas- sic multilayer PCB design process is not adequate for additive, because no copper layers are used in additive manufacturing. These designs are produced "dot per dot" in lat- eral and vertical dimensions. What is the most important piece of advice that you have for your audience? The additively manufacturing process is not compa- rable in terms of cost with standard manufacturing processes, especially for large series. The benefit comes from the higher integration, adaptability, and lower space requirements for the customer applica- tion. To exploit this benefit, a new tool and manufac- turing chain is required. IPC APEX EXPO: Conference Speakers Speak Out Impacts and Challenges of AME, From Design to Data

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