Show & Tell Magazine

30 I-CONNECT007 I REAL TIME WITH... IPC APEX EXPO 2022 SHOW & TELL MAGAZINE Acuity Electronics, Nicholas Huffer Material Traceability for Automotive Aegis Software, Jason Spera Connecting the Digital Thread Aismalibar, Jeff Brandman The Growing Demand for Automation all4-PCB, Torsten Reckert Latest Trends in PCB Manufacturing Equipment AltiumLive, Kelly Dack AltiumLive Goes Virtual Altix, Sylvain Dromaint A New Direct Imaging System American Standard Circuits, Anaya Vardya The PCB Fabricator Voice Arlon, Deanna Bustamante High Speed Material ASTER Technologies, Willam Webb Test Coverage Puts Results at Your Fingertips Averatek, Mike Vinson Additive and Semi-Additive Manufacturing Blackfox Training Institute, Vince Price IPC Training Updates BTU, Rob DiMatteo BTU International's New Aqua Scrub Burkle North America, Dick Crowe Industry Icons Reflect Burkle North America, Kurt Palmer PCB Manufacturing Today CalcuQuote, Kaitlyn Dotson Current EMS Trends Calumet Electronics, Todd Brassard The Latest Trends of the Industry CyberOptics, Subodh Kulkarni Advanced Metrology and Inspection DownStream Technologies, Joe Clark Disruptive Technologies Growing Business Electra Polymers, Ashley Steers Supplying the U.S. Market for 30 Years Electrolube, Beth Turner Good for the Environment Electrolube, Phil Kinner The Winds of Change Elmatica, Jan Pedersen Ultra HDI/Substrate-like PCBs Essemtec USA, Pierre Marechal An All-in-One Unique Solution Flexible Circuit Technologies, Chris Clark Flexible Circuit Specialists Floor Interview, Kris Moyer, Kevin Kusiak, Russ Steiner, Steve Roy IPC Design Competition: Meet the Judges H-Technologies Group, Dr. Jennie Hwang Thoughts on Mega Trends Hitachi High-Tech Analytical Science, Dean Schmidt Electronics Coating Quality Control Horizon Sales, David Trail Standards in Process Test ICAPE Group, Paulo Franca ICAPE Continues to Expand Indium Corporation, Chris Nash Automotive Electrification International Electronic Components (IEC), Shawn Stone Continuous Supply Chain INVAP, Adrian Oscar Danta New Technologies at IPC APEX EXPO 2022 IPC, Shawn DuBravac Speaking of the Economy IPC, Randy Cherry Update on IPC's Validation Services IPC, Charlene Gunter du Plessis We Can All Learn Something

• Real Time with… IPC APEX EXPO 2022 Show & Tell Magazine
• Contents
• More Contents
• It's Great to Be Back
• IPC APEX EXPO 2022: Better Than Expected!
• Industry Reconnects—IPC APEX EXPO 2022 Reconvenes as Live, In-Person Event
• Conference Speakers Speak Out — Leveraging CFX-QPL to Integrate Equipment and Create a Smart Factory
• Real Time with… IPC APEX EXPO Video Showcase
• Real Time with… IPC APEX EXPO Video Library
• Thank You to the I-Connect007 Team
• Joe O'Neil Joins Illustrious Group of IPC Hall of Famers
• Happy's Thoughts
• Conference Speakers Speak Out — IPC-HERMES-9852 Lays the Foundation for Automated Flexible Production
• David Pogue Ketnote Opens IPC APEX EXPO 2022
• David Pogue: Is the Fear of Change Holding Us Back?
• Best Technical Papers at IPC APEX EXPO 2022 Selected
• A Conversation with Two Student Leaders
• Voices of the Industry — Allison Budvarson, Out of the Box Manufacturing
• Conference Speakers Speak Out — Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs
• Voices of the Show — Yan Manissadjian, Mycronic
• Bob Neves: IPC Continues Global Reach
• Conference Speakers Speak Out — Microvia Reliability Testing Utilizing D-Coupons to Understand Best Design Practice
• Conference Speakers Speak Out — Sn-Cu Intermetallic Growth Study with XRF-CS Method
• IPC's Dieter Bergman Fellowship Awards—Bev Christian, HDPUG
• IPC's Dieter Bergman Fellowship Award—Doug Pauls, Collins Aerospace
• Voices of the Show — Nilesh Naik, Sava Holdings, Ltd.
• IPC's Dieter Bergman Fellowship Award—Jose Servin, Vitesco Technologies
• Conference Speakers Speak Out — Qualification Protocols for a Sustainable and Innovative Release Aid Within the PCB and CCL Laminating Press Process
• IPC President's Award Winner — Zhiman (Susann) Chen
• IPC President's Award Winner — Joe Kane
• Conference Speakers Speak Out — FIDES Reliability: New Approach to the 'Process Factor' During Product Development
• IPC Student Director: Three Things IPC APEX EXPO Taught Me
• IPC Education Foundation STEM Outreach
• New IPC Excellence in Education Award Presented to Tabbatha Greek
• Automotive Initiatives Make Headway at IPC APEX EXPO
• The IPC STEM Event Inspires
• IPC APEX EXPO From a College Student's Perspective
• Conference Speakers Speak Out — Solder Alloy Contribution to Robust Selective Soldering Process
• Voices of the Show — Bob Neves, Microtek Laboratories China
• IPC EMS Leadership Summit: Peer Solutions to Supply Chain and Labor Development
• Conference Speakers Speak Out — High-Temperature Thermal Cycling Reliability Testing of a High-Reliability Lead-free Solder Alloy
• Supply, Sustain, Socialize: The Three S's of IPC APEX EXPO 2022
• Conference Speakers Speak Out — Impacts and Challenges of AME, From Design to Data
• Jessie Vaughan: An Emerging Engineer in Practice Video
• Conference Speakers Speak Out — Lead-free Low-Temperature Solder Paste for Drop Shock-Critical Applications
• John Mitchell Keynote Review: The Future is Now
• Voices of the Show: Jerry Reitz, Chemcut
• Focused on Training
• Conference Speakers Speak Out — Advances in Multi-level and Multi-material Additively Manufactured Electronic (AME) Circuits and Devices
• Stakeholder's Paradise—Part Deux: Show 'Revieux'
• Conference Speakers Speak Out — FAS Chemistries and Materials: Their Essential Uses in Semiconductor Manufacturing and Products, Pending Regulatory Restrictions, and Response Strategies
• Voices of the Show: Christopher Bonsell, Chemcut
• Conference Speakers Speak Out — Re-balancing of the Electronic Equipment Manufacturing Industry
• Conference Speakers Speak Out — Eco-Design for a Circular Economy: Best Practices in the Electronics Industry
• Top 10 Takeaways from IPC APEX EXPO 2022
• Conference Speakers Speak Out — Cyberattack Response BCP (Business Continuity Plan)
• Conference Speakers Speak Out — Electro-thermal-mechanical Modeling of One-Dimensional Conductors, Whiskers, and Wires Including Convection, and Considering Tin, Bismuth, Zinc and Indium
• Conference Speakers Speak Out — A Comparative Cycle Assessment of Stretchable and Rigid Electronics
• The Top 5 Things You Need to Know About
• Conference Speakers Speak Out — Printed Circuit Structures, the Past, Present, and Future
• Conference Speakers Speak Out — A Multiphase Model of Intermittent Contact in Lubricated Electrical Contacts
• From Ultra HDI and Compliance to the Resurrection of a Baywatch Star
• IPC Design Competition Celebrates the Art and Science of Printed Board Design
• Voices of the Show: Zack Burruel, Titan Circuits
• Taking a Closer Look at Factory of the Future
• Conference Speakers Speak Out — Empowering Digital Supply Chain Transformation by Utilizing Industry 4.0, Technical Standards, Smart Contacts and Blockchains
• Conference Speakers Speak Out — Next Progression in Microvia Reliability: Refow Simulation of PCB Design Attributes and Material Structural Properties at Design
• Conference Speakers Speak Out — The Gap Dilemma in the Technical Cleanliness of Electronic Assemblies: Why Foreign Object Debris on Electronic Assemblies is Not Bringing the Modern World to a Halt
• Voices of the Show: Rachael Temple, Alltemated
• Advertiser Index and Masthead
• IPC APEX EXPO 2023 Ad