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176 I-CONNECT007 I REAL TIME WITH... IPC APEX EXPO 2022 SHOW & TELL MAGAZINE e IPC Connected Factory Exchange (IPC- CFX) standard provides genuine plug-and- play IIoT data exchange between machines and supervisory systems across the shop floor. To realize the benefit of IPC-CFX, however, the whole value chain of production stations should be considered, as any missing link becomes a blind spot for even the most basic visibility and control. e smart factory project for electron- ics manufacturing initiative was developed to create a sandbox to carry out Industry 4.0 use cases working with industrial members and partners. e Manufacturing Technology Centre (MTC) based in Coventry, UK, has carried out a project that outlines the imple- mentation of IPC CFX to demonstrate the connectivity between the machine, the broker and the dashboard. e main objective focuses on the implementation elements for the Adap- tor machines and the RabbitMQ server. is includes configuration requirements and user guides around maintaining the delivered implementation. e paper reviews the above example of the successful connection using IPC CFX, an SMT DEK printer and the Ersa Reflow 10-zone oven which are both classed as leg- acy machines due to their age and the oper- ating system. e benefits to this are to allow legacy machines used in the electronics manu- facturing industry to communicate, transfer operational data for track/trace, and moni- toring while, in future add-ons, allow them to be agile and have autonomous ability to change parameters based on the live shop floor Presenter: Gerry Partida, VP of Technology, Summit Interconnect What is the most interesting question that your IPC APEX EXPO presentation answers? It is now possible to simulate the reliability of a microvia design and material selection at the design stage. This simulation can save years of pain and suffer- ing and improve the odds of designing and fabri- cating a PCB right the first time. What is your answer to that question, and why? Simulation of material selections and microvia attri- butes can predict if a design can survive the neces- sary reflow cycles at the intended assembly tem- perature. By characterizing the structural integrity of a microvia design, we can determine if a design and material selection is safe for final assembly. If the simulation determines that the design is weak, the designer could modify the design to improve the reliability. A fabri- cator would be able to recommend the best combination of materials to improve the amount of reflows the PCB could with- stand. What is the most important piece of advice that you have for your audience? This new ability to simu- late microvia reliability is both a revolutionary and evolutionary approach for HDI PCBs. We can now determine in 15–20 minutes whether a design is reliable, or a design or material change is required. For years, OEMs have lost product cycle time and large sums on money on designs that do not work or have high fallout in assembly or in the field. This new approach can prevent these occurrences in the future. IPC APEX EXPO: Conference Speakers Speak Out Next Progression in Microvia Reliability: Reflow Simulation of PCB Design Attributes and Material Structural Properties at Design

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