Issue link: https://iconnect007.uberflip.com/i/1454922
180 I-CONNECT007 I REAL TIME WITH... IPC APEX EXPO 2022 SHOW & TELL MAGAZINE variables in the columns if there is some knowledge of an identifiable batch that is better or worse than the others. A perfor- mance characterization on a batch of units was successfully performed to identify the anomalies within a dataset. Additional papers presented in these tracks (FF1, FF2. FF3, FF4, FF5, and FF6) include: S13/FF4 Session • "Industry Trends and Application Requirements for Adopting Solder Paste Printer Changeover Automation," by Wayne Wang, ITW EAE. • "IPC-HERMES-9852 Lays the Foundation for Automated Flexible Production," by omas Marktscheffel, ASM Gmbh & Co. KG. SO5/FF2 Session • "Digital Twin/Data Transformation: Digital Twin: e Glue for Industrial Transformation," by Joanne Friedman, Connektedminds Inc. • "Single Source of Truth (PathWave Manufacturing Analytics)," by Juliann Forbes, Keysight Technologies, Inc. S09/FF3 Session • "Innovative Technologies: Surface Mounting in Smart Molded Structures with Polypropylene," by Outi Russnen, TactoTek. • "A Comparative Life Cycle Assessment of Stretchable and Rigid Electronics," by Gustaf Martensson, Mycronic. • "A Study of AI Model Benchmarking for Quality Inspection Implementation in Manufacturing Using Edge Computing," by Feng Xue, IBM Corp. • "Towards Artificial Intelligence in SMT Inspection Processes," by Marlo Peutier, Continental Automotive GmbH • "AI for Electronics Manufacturing_V," by Jay Taylor, Manufacturing Technology Centre, UK S17/FF5 Session • "Modernizing the Supply Chain: Factory of the Future Implementation," by James Becker, Northrup Grumman Corp. • "Improving Productivity with Automated Component Storage and Delivery," by Patricia Heredia, Omron. • "Empowering Digital Supply Transforma- tion by Utilizing Industry 4.0 Technical Standards, Smart Contracts and Block- chain," by Sukhraj Tekhar, Assent Compliance. S25/FF6 Session • "Cybersecurity: Cyber Attack Response BCP Trying to Make the Incident Response for the Factory," by Hiroyuki Watanabe, NEC Corporation. • "How Will Cyber Security and Export Compliance Control the PCB Supply Chain and How Can We Prepare for it?" by Didrik Bech, Elmatica. • "IPC-2581: Secure Data Exchange Between Design and Manufacturing," by Hemant Shaw, IOPC-2581 Consortium. is was a good track of papers for those interested in Factory of the Future or bet- ter titled, "Creating your own smart factory now." It complements the two keynotes from APEX EXPO talking about the new opportu- nities for higher performance that should be had by investing in these evolutionary tech- nologies. S&T