Show & Tell Magazine

REAL TIME WITH... IPC APEX EXPO 2022 SHOW & TELL MAGAZINE I I-CONNECT007 21 Burkle North America, Kurt Palmer PCB Manufacturing Today Dick Crowe (right) interviews Kurt Palmer, president of Burkle North America, on the trends he sees in PCB manufacturing today. From LDI to laser drills, they cover a wide range of concerns and opportunities. ASTER Technologies, Willam Webb Test Coverage Puts Results at Your Fingertips William Webb shares with Andy Shaughnessy the latest in design for test (DFT), including the compa- ny's new test coverage analysis. Nordson ASYMTEK, Camille Sybert Time to Conform Joe Fjelstad of I-Connect007 talks with Camille Syb- ert of Nordson ASYMTEK about conformal coating equipment and process options, as well as material and market demands.

• Real Time with… IPC APEX EXPO 2022 Show & Tell Magazine
• Contents
• More Contents
• It's Great to Be Back
• IPC APEX EXPO 2022: Better Than Expected!
• Industry Reconnects—IPC APEX EXPO 2022 Reconvenes as Live, In-Person Event
• Conference Speakers Speak Out — Leveraging CFX-QPL to Integrate Equipment and Create a Smart Factory
• Real Time with… IPC APEX EXPO Video Showcase
• Real Time with… IPC APEX EXPO Video Library
• Thank You to the I-Connect007 Team
• Joe O'Neil Joins Illustrious Group of IPC Hall of Famers
• Happy's Thoughts
• Conference Speakers Speak Out — IPC-HERMES-9852 Lays the Foundation for Automated Flexible Production
• David Pogue Ketnote Opens IPC APEX EXPO 2022
• David Pogue: Is the Fear of Change Holding Us Back?
• Best Technical Papers at IPC APEX EXPO 2022 Selected
• A Conversation with Two Student Leaders
• Voices of the Industry — Allison Budvarson, Out of the Box Manufacturing
• Conference Speakers Speak Out — Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs
• Voices of the Show — Yan Manissadjian, Mycronic
• Bob Neves: IPC Continues Global Reach
• Conference Speakers Speak Out — Microvia Reliability Testing Utilizing D-Coupons to Understand Best Design Practice
• Conference Speakers Speak Out — Sn-Cu Intermetallic Growth Study with XRF-CS Method
• IPC's Dieter Bergman Fellowship Awards—Bev Christian, HDPUG
• IPC's Dieter Bergman Fellowship Award—Doug Pauls, Collins Aerospace
• Voices of the Show — Nilesh Naik, Sava Holdings, Ltd.
• IPC's Dieter Bergman Fellowship Award—Jose Servin, Vitesco Technologies
• Conference Speakers Speak Out — Qualification Protocols for a Sustainable and Innovative Release Aid Within the PCB and CCL Laminating Press Process
• IPC President's Award Winner — Zhiman (Susann) Chen
• IPC President's Award Winner — Joe Kane
• Conference Speakers Speak Out — FIDES Reliability: New Approach to the 'Process Factor' During Product Development
• IPC Student Director: Three Things IPC APEX EXPO Taught Me
• IPC Education Foundation STEM Outreach
• New IPC Excellence in Education Award Presented to Tabbatha Greek
• Automotive Initiatives Make Headway at IPC APEX EXPO
• The IPC STEM Event Inspires
• IPC APEX EXPO From a College Student's Perspective
• Conference Speakers Speak Out — Solder Alloy Contribution to Robust Selective Soldering Process
• Voices of the Show — Bob Neves, Microtek Laboratories China
• IPC EMS Leadership Summit: Peer Solutions to Supply Chain and Labor Development
• Conference Speakers Speak Out — High-Temperature Thermal Cycling Reliability Testing of a High-Reliability Lead-free Solder Alloy
• Supply, Sustain, Socialize: The Three S's of IPC APEX EXPO 2022
• Conference Speakers Speak Out — Impacts and Challenges of AME, From Design to Data
• Jessie Vaughan: An Emerging Engineer in Practice Video
• Conference Speakers Speak Out — Lead-free Low-Temperature Solder Paste for Drop Shock-Critical Applications
• John Mitchell Keynote Review: The Future is Now
• Voices of the Show: Jerry Reitz, Chemcut
• Focused on Training
• Conference Speakers Speak Out — Advances in Multi-level and Multi-material Additively Manufactured Electronic (AME) Circuits and Devices
• Stakeholder's Paradise—Part Deux: Show 'Revieux'
• Conference Speakers Speak Out — FAS Chemistries and Materials: Their Essential Uses in Semiconductor Manufacturing and Products, Pending Regulatory Restrictions, and Response Strategies
• Voices of the Show: Christopher Bonsell, Chemcut
• Conference Speakers Speak Out — Re-balancing of the Electronic Equipment Manufacturing Industry
• Conference Speakers Speak Out — Eco-Design for a Circular Economy: Best Practices in the Electronics Industry
• Top 10 Takeaways from IPC APEX EXPO 2022
• Conference Speakers Speak Out — Cyberattack Response BCP (Business Continuity Plan)
• Conference Speakers Speak Out — Electro-thermal-mechanical Modeling of One-Dimensional Conductors, Whiskers, and Wires Including Convection, and Considering Tin, Bismuth, Zinc and Indium
• Conference Speakers Speak Out — A Comparative Cycle Assessment of Stretchable and Rigid Electronics
• The Top 5 Things You Need to Know About
• Conference Speakers Speak Out — Printed Circuit Structures, the Past, Present, and Future
• Conference Speakers Speak Out — A Multiphase Model of Intermittent Contact in Lubricated Electrical Contacts
• From Ultra HDI and Compliance to the Resurrection of a Baywatch Star
• IPC Design Competition Celebrates the Art and Science of Printed Board Design
• Voices of the Show: Zack Burruel, Titan Circuits
• Taking a Closer Look at Factory of the Future
• Conference Speakers Speak Out — Empowering Digital Supply Chain Transformation by Utilizing Industry 4.0, Technical Standards, Smart Contacts and Blockchains
• Conference Speakers Speak Out — Next Progression in Microvia Reliability: Refow Simulation of PCB Design Attributes and Material Structural Properties at Design
• Conference Speakers Speak Out — The Gap Dilemma in the Technical Cleanliness of Electronic Assemblies: Why Foreign Object Debris on Electronic Assemblies is Not Bringing the Modern World to a Halt
• Voices of the Show: Rachael Temple, Alltemated
• Advertiser Index and Masthead
• IPC APEX EXPO 2023 Ad