Issue link: https://iconnect007.uberflip.com/i/1454922
REAL TIME WITH... IPC APEX EXPO 2022 SHOW & TELL MAGAZINE I I-CONNECT007 61 In addition to the "best of " categories, eight papers were selected in the honorable mention category. Honorable mentions go to: • "Towards Artificial Intelligence in SMT Inspection Processes" by Mario Peutler, Continental Automotive GmbH; co-authors Michael Boesl, Johannes Brunner and Thomas Kleinert, Ph.D., Continental Automotive GmbH. • "A Multiphase Model of Intermittent Contact in Lubricated Electrical Contacts" by Robert Jackson, Auburn University; co-author Santosh Angadi, Nitte Meenakshi Institute of Technology. • "Electro-thermal-mechanical Modeling of One-Dimensional Conductors, Whiskers, and Wires Including Convection, and Considering Tin, Bismuth, Zinc and Indium" by Robert Jackson, Auburn University; co-author Erika R. Crandall, TE Connectivity. • "Design and Testing of Three Levels of Microvias for High-Reliability PCBs" by Maarten Cauwe, Ph.D., imec-CMST; co- authors Jason Furlong, PWB Interconnect Solutions; Stan Heltzel, ESA-ESTEC; Marnix Van De Slyeke, ACB; Bob Neves, Microtek Changzhou Laboratories; Kevin Knadle, TTM Technologies. • "Recrystallisation and the Resulting Crystal Structures in Plated Microvias" by Roger Massey, Atotech GmbH; co- authors T. Bernhard, K. Klaeden, S. Zarwell, S. Kempa, E. Steinhaeuser, S. Dieter, F. Brüning, all with Atotech GmbH. • "Defluxing of Copper Pillar Bumped Flip Chips" by Ravi Parthasarathy, ZESTRON Corporation; co-author Umut Tosun, ZESTRON Corporation. • "Reliability SoH Degradation and Life Prediction of Thin Flexible Batteries Under Flex-to-Install Dynamic Folding, Dynamic Twisting and Battery Lamination" by Pradeep Lall, Ph.D., Auburn University; co- authors Ved Soni, Jinesh Narangaparambil, Hyesoo Jang, Auburn University; Scott Miller, NextFlex Manufacturing Institute. • "Electromechanical Testing of Flexible Hybrid Electronics" by Mark Poliks, Ph.D., Binghamton University; co-authors Moham- med Alhendi, Behnam Garakani, Udara S. Somarathna, Gurvinder Singh Khinda, all with State University of New York at Binghamton. All technical conference papers were evalu- ated on their technical content, originality, test procedures, and data used to deduce conclu- sions, quality of illustrations and the clarity and professionalism of writing as well as value to the industry. S&T Kevin Knadle Beth Turner