Issue link: https://iconnect007.uberflip.com/i/1467744
32 PCB007 MAGAZINE I MAY 2022 Reckert: Correct. Johnson: Step through some of the manufac- turing processes and tell me where automa- tion is reducing the labor requirement. What should a fabrication facility be researching? Reckert: In our experience, the pressure is usu- ally highest in the inner layer processing area because of the quantity of materials that must be handled, and the attention required in han- dling the material. On the develop/etch/strip line, the post- etch punch line, or on the oxide line prior to lamination, people want to automate these horizontal conveyorized machines first, if they can. at then translates to the handling of the same materials for imaging, with direct image with AOI. Matties: Are you seeing a lot of interest in the additive market? When you add it all up, it seems a reasonable investment to bring addi- tive as a capability into a facility. Reckert: ere's a lot of discussion, and some people are trying it. But this is something peo- ple must be very careful about. I'm sure Happy remembers, but in the 1990s, HDI technology with resin copper foil and other methodologies was coming to the U.S. It was in demand for consumer electronic type products, like cellphone boards. It needed tight geometries even by today's standards. In the U.S. market, almost nobody was willing to invest in the equipment, the cleanroom areas, and everything that you needed. As a result, it didn't happen. e Asians addressed that need very rapidly and consumer electronics shied to Asia. ey would just build greenfield plants with all the necessary equipment to do it right in a very clean environment. Virtually nothing got built in North America. Matties: In your example from 20 years ago, did you bring that up because you have some doubt that additive will land here? Reckert: I think it's actually going to happen now because current geopolitics point to the need in North America to become indepen- dent from Asia. If the U.S. strategically wants to be independent from a supply chain stand- point for very critical product, then the capa- bility has to be here in North America. Everybody's seeing that now with the world and Ukraine. Until recently we were support- ing all the circuit board equipment manufac- turers, especially European ones. ey were selling as much as they could into the Russian circuit board market. It was easy selling. But not anymore. China seems headed in a simi- lar direction, politically. ere could be a lot of tension in the future. So yeah, the U.S. has to get involved in this high-density interconnect technology, which I know, Happy, you've been preaching for 30 years. Enclosed automation with transport cart. Torsten Reckert