Issue link: https://iconnect007.uberflip.com/i/1467744
info @ atotech.com w w w.atotech.com CupraEtch ® SR 8000 & DF 8000 – Surfaces that mean the world The increasing OEM demand for advanced HDIs with L/S requirements below 30 µm has inspired Atotech to develop cupric chloride-based etchants that offer improved adhesion at lower etch depth and etch rate than comparable products. The results are our brand new developments, CupraEtch ® SR 8000 and CupraEtch ® DF 8000, which are ideal for solder mask and dry film pretreatments and can be used uni versally, providing uniform and reliable adhesion to all copper types. The three-step adhesion enhancement processes are metalcomplexfree and already OEMqualified. Both processes significantly optimize and reduce wastewater treatment, resulting in significant cost savings and a more sustainable production. To find out more about CupraEtch ® SR 8000 & DF® 8000, scan the QR-code to the right.