PCB007 Magazine

PCB007-May2022

Issue link: https://iconnect007.uberflip.com/i/1467744

Contents of this Issue

Navigation

Page 60 of 119

MAY 2022 I PCB007 MAGAZINE 61 need for materials with better and more con- sistent dielectric properties. His triangular representation of low-loss materials had FR-4 grades at the base and PTFE at the apex, with many proprietary products occupying the intermediate levels. Not just price, but avail- ability, could influence the choice and again he stressed the importance of consulting the PCB supplier before specifying a particular propri- etary material. Turning to the characteristics of woven- glass reinforced materials, he illustrated how glass weave and resin content could cause local variations in dielectric constant and hence the impedance uniformity of embedded conduc- tors. He discussed details of component place- ment and conductor routing, and gave several examples of good and bad practice in optimis- ing signal integrity. It was clear that Op den Camp himself had high-level expertise as a designer in addition to his knowledge of mate- rials and fabrication technology. He echoed Hermann Reischer's comments on the bene- fits of back-drilling via stubs, and also recom- mended the removal of non-functional pads on high-speed vias. NCAB had a whole series of design rules and guidelines available for download from their website, and their applications engineers were always on hand to answer specific questions. Having learned the theoretical background of signal integrity and controlled imped- ance, complemented by a review of the prac- tical aspects of the design and manufacture of printed circuit boards for high-speed applica- tions, it remained to explore the technology of ensuring the integrity of the signal as it passed through interconnecting components. e final presentation came from a Phoenix Con- tact specialist in the design and optimisation of data connectors, Sebastian Stamm. He began by making it clear that although signal integrity was a very important consid- eration, it was one of many product require- ments. Cost and installation space were fac- tors that reduced design freedom. erefore the target was not to achieve signal integrity at any price, but to produce application-oriented connectors with high signal integrity. Sebastian Stamm

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB007-May2022