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86 SMT007 MAGAZINE I JUNE 2022 Our library is open 24/7/365. Visit us at: I-007eBooks.com Solder Defects by Christopher Nash and Dr. Ronald C. Lasky, Indium Corporation This book is specifically dedicated to educating the printed circuit board assembly sector and serves as a valuable resource for people seeking the most relevant information available. SMT Inspection: Today, Tomorrow, and Beyond by Brent Fischthal, Koh Young America An in-depth insight into new and exciting true 3D inspection technology is provided in this book, along with a look into the future of leveraging big data management and autonomous manufacturing for a smarter factory. Smart Data: Using Data to Improve Manufacturing by Sagi Reuven and Zac Elliott, Siemens Digital Industries Software Manufacturers need to ensure their factory operations work properly, but analyzing data is simply not enough. Companies must take efficiency and waste-reduction efforts to the next phase using big data and advanced analytics to diagnose and correct process flaws. Process Validation by Graham K. Naisbitt, Gen3 This book explores how establishing acceptable electrochemical reliability can be achieved by using both CAF and SIR testing. This is a must-read for those in the industry who are concerned about ECM and want to adopt a better and more rigorous approach to ensuring electrochemical reliability. Advanced Manufacturing in the Digital Age by Oren Manor, Siemens Digital Industries Software A must-read for anyone looking for a holistic, systematic approach to leverage new and emerging technologies. The benefits are clear: fewer machine failures, reduced scrap and downtime issues, and improved throughput and productivity. WATCH AND LEARN Predicting Reliability in Electronics In this engaging, 11-part micro webinar series, topic experts Graham Naisbitt and Chris Hunt examine the history of the influences of electro- chemical migration (ECM) and the evolving use of Surface Insulation Resistance (SIR) testing that has been developed over the past 25 years by GEN3 and its association with the British National Physical Laboratory. GEN3 and NPL have created the standard that has now been in wide- spread use around the world since the turn of the millennium.