Design007 Magazine

Design007-Aug2022

Issue link: https://iconnect007.uberflip.com/i/1475604

Contents of this Issue

Navigation

Page 18 of 99

AUGUST 2022 I DESIGN007 MAGAZINE 19 by Happy Holden, The PCB Magazine, November 2016. 4. "Against the Density Wall: Landless Vias Might be the Answer," by Happy Holden, The PCB Maga- zine, June 2016. 5. Happy's TechTalk #6: Looking at the Process of Repanelization, by Happy Holden, PCB007 Maga- zine, March 2022. References 1. The HDI Handbook, by Happy Holden, et al, BR Publishing, Salem, Oregon, 2009. 2. Happy's TechTalk #1: Vertical Conductive Struc- tures (VeCS), by Happy Holden, PCB007 Magazine, October 2021. 3. "Innovative Use of Vias for Density Improvements," Figure 2: VeCS (Vertical Conductive Structures) is a licensed technology using low-footprint vertical controlled impedance interconnect with low-leakage ground shielding capable of matching interconnect impedance with SE and differential microstrip and striplines. VeCS also provides high-density differential routing solutions in =/< 1.0 mm BGA area. Unique "anti-pad" layers provide a higher cross-section area for power and heat dissipation. Figure 3: A variety of examples of landless vias on the outer layers of a PCB.

Articles in this issue

Links on this page

Archives of this issue

view archives of Design007 Magazine - Design007-Aug2022