175°C warp HRL3 245°C warp SAC305
ALPHA
®
OM-565 HRL3 Solder Paste
Low Temperature, High Reliability
• Enhanced mechanical reliability
over traditional SnBi solder pastes
• Superior wettability minimizing
warpage induced defects
• Enabling peak re ow temperature
of 175°C
• Increases energy e• iciency and
cost savings
Minimize Warpage Induced Defects to
Maximize Assembly Yield.
www.macdermidalpha.com
