SMT007 Magazine


Issue link:

Contents of this Issue


Page 63 of 91

64 SMT007 MAGAZINE I OCTOBER 2022 IPC APEX EXPO 2023 Offers New Courses, New Instructors, and IPC E-Textiles E Registration is now open for IPC APEX EXPO 2023, the largest event for electronics manu- facturing in North America. IPC APEX EXPO will be held at the San Diego Convention Center in San Diego, California from January 21–26, 2023. Boeing Invests $5 Million in Advanced Manufacturing Innovation Center in St. Louis E Boeing announced it is investing $5 million to help expand the Advanced Manufactur- ing Innovation Center in St. Louis, Missouri. e investment will help fund a state-of-the- art advanced manufacturing facility, accelerate workforce development programs, and grow the region's talent pipeline and technical and manufacturing abilities. Explore the Solar System With NASA's New-and-Improved 3D 'Eyes' E NASA has revamped its "Eyes on the Solar Sys- tem" 3D visualization tool, making interplane- tary travel easier and more interactive than ever. Summit Interconnect Names Sean Patterson COO E Sean Patterson, a veteran manufacturing exec- utive, has joined Summit Interconnect, North America's largest privately held PCB manufac- turer, as chief operating officer. In this posi- tion, Patterson will oversee all facets of oper- ations that serve Summit's growing customer base. Summit's former COO, Greg Halvorson, will remain at the company part-time as advi- sor to the CEO. Your Handy Guide to PCB Legislation Headlines E We know you have so many questions about what the legislation means for you. Will there be funds to expand or upgrade my facilities? What about tax breaks? How will my specific needs be known? Use this handy guide to get caught up. Will Marsh: CHIPS Act Update E Now that the CHIPS Act has become law, Nolan Johnson reconnects with PCBAA President Will Marsh to ask: What now? Will brings Nolan up to speed on the initial stages of implementation and administra- tion, and provides more insight on the Sup- porting American Printed Circuit Boards Act of 2022. IPC Advanced Packaging Symposium to Draw Industry, Government Representatives E No lan Jo hns on sp eak s w ith I P C's Chr i s Mitchell, vice president of global government relations, and Matt Kelly, chief technologist, about the inaugural IPC Advanced Packag- ing Symposium, scheduled for October 11–12, 2022, in Washington, D.C. Michigan Tech's Middlebrook Receives Department of Defense Award E e Department of Defense honored Michigan Technological University professor Dr. Chris- topher Middlebrook with an award for his innovative efforts to close education gaps and help build tomorrow's electronics manufactur- ing workforce.

Articles in this issue

Links on this page

Archives of this issue

view archives of SMT007 Magazine - SMT007-Oct2022