Issue link: https://iconnect007.uberflip.com/i/1480758
OCTOBER 2022 I SMT007 MAGAZINE 63 Cleaning and No-Clean Process Control Using the SIR Test Method and Electrical Twin Richard Brooks, Spartronics Case Study: Analyzing 0402 Capacitor Defects with Stencil Printing Misalignment When Using Water Soluble and No-Clean Solder Pastes Xinzhi Feng, Rochester Institute of Technology Thursday, November 3 Implementing the D-Value to Supplement the P-Value in Electronic Assembly Ronald Lasky, Ph.D., P.E., Indium Corporation Pad-to-Pad Electrical Field Effects on Surface Insulation Resistance David Lober, KYZEN Corporation/Magnalytix, LLC Reduction of Voiding in SMT Processing of BTC/QFN Component Packages Jeff Nelson, Spartronics Stencil Printing: Understanding the Effects of Fixed Variables on Print Quality Chrys Shea, SHEA Engineering Services Engineered Cleaning Agent Study as a Function of Rinsing Under Low Profile Components Vladimir Sitko, PBT-Works s.r.o. Solder Paste Printing from a Reliability Perspective David Spitz, Ansys, Inc. Do We Need to Switch to Type 5 Solder Pastes? Conducting a Midsize DoE to Find Answers Esra Stoll, Basler AG Single Source of Truth Crystal Tan, Keysight Technologies Influence of PCB Design and Manufacturing Process on PCB BGA Land Pattern Warpage and SMT Yield Satyajit Walwadkar, Intel Corporation Technical Innovations Tuesday, November 1 ASM Digital Factory Olimpiu-Petru Dactu, ASM Assembly Systems GmbH & Co. KG Artificial Intelligence and Machine Learning Applications in Electronics Manufacturing Zac Elliott, Mentor a Siemens Business Steffen Klawitter, Mentor a Siemens Business Inline Assembly of Flex PET Circuits Ara Parsekian, PulseForge Corporation The Challenge and Solution for Implementing Automation and AI for Electronic Card Assembly Wayne Zhang, IBM Corporation Test and Inspection Wednesday, November 2 Development of Solder Joint Void Metrology to Monitor Solder Joint Quality in Printed Circuit Board Assemblies Thaer Alghoul, Ph.D., Intel Corporation X-ray Computed Tomography for Printed Circuit Board Inspection Robert Boguski, Datest Corporation Non-contact Measurement of Conformal Coating Thickness using Chromatic Confocal Microscopy (CCM) Wilson Chen, Insituware Automation for Traceability and Reliability Alejandro Rodriguez, Plexus Corp. Paradigm Shift—DFT Analysis Driven by Test Coverage Instead of Accessibility William Webb, ASTER Technologies Application of X-ray Inspection Beyond BTCs Carlos Valenzuela, Creative Electron