Issue link: https://iconnect007.uberflip.com/i/1480758
62 SMT007 MAGAZINE I OCTOBER 2022 Medical and Defense Symposium Monday, October 31 Thinking Inside the ESD Bag on Cleanliness— Numerous and Potentially Dangerous Contami- nation Contributors to Long Term Failure Eric Camden, Foresite Inc. 3D Process Jonathan Corona, Plexus Corp. PCB De-paneling: Less is More, a Review of Technologies and Vision usage in De-paneling Allen Duck, Detech Automation Effect of Voltage Bias on SIR Measurements Elliott Fowler, Ph.D., Sandia National Laboratories Meeting Today's Challenge for Low VOC Defluxing Agents For Electronics Manufacturing Terry Price, ZESTRON Corporation Does Proper Solder Thickness Matter When Processing? Yes Brian Wilson, HiRel Services Continuous Improvement: The Task That Never Ends in the Cleaning World Ram Wissel, KYZEN Corporation Tuesday, November 1 Component Pressure Exposure Validation in a Inline Wash System and Why Low Pressure is Critical Bill Capen, Honeywell FM&T A Holistic Approach to Surface Insulation Resis- tance Interdigitated Comb Design Elliott Fowler, Ph.D., Sandia National Laboratories High-Reliability Adhesive Bonding Through Atmospheric Plasma Treatment Adam Klett, L3Harris Low Stress De-Paneling and Why It Is Critical for Long Term Reliability Michelle Ogihara, Seika Machinery, Inc. Manufacturing Excellence Wednesday, November 2 Impact of Stencil Manufacturing Technology and Supplier's Capability on Performance of Multi-Level/ Step Stencils Supriya Agrawal, Intel Corporation An Innovative Contactless Technology for High Resolution, High Speed, Solder Paste Deposition Ralph Birnbaum, Ph.D., ioTech Ensuring the Reliability of Critical Assemblies When Implementing a New Cleaning Chemistry Richard Brooks, Spartronics Stencil Cleaning Optimization for Fine-Pitch Components Sebastian Iturregui-Shelton, Rochester Institute of Technology Beyond ECM—Additional Reasons to Clean Circuit Assemblies Michael Konrad, Aqueous Technologies Cleaning Performance Evaluations and Best Practices for Novel Jettable Pastes for Advanced SMT Assembly Processes Kalyan Nukala, PMP, ZESTRON Corporation Thursday, November 3 Secure Data Exchange Between Design and Manufacturing Using IPC-2581 Ivan Aduna, Koh Young Technology, Inc. Using the Principles of Concurrent Education to Teach a Post-Secondary Engineering Program: An Example from the Curriculum of the Forth- coming Jefferson Institute of Technology Tom Borkes, The Jefferson Project