Issue link: https://iconnect007.uberflip.com/i/1480758
58 SMT007 MAGAZINE I OCTOBER 2022 Challenges for Conformally Coated Networking Equipment in Extremely Harsh Environment Chuan Xia, Cisco Systems New Technologies Speed Presentations and Panel Discussion Panelists: Mark Ronay, Liquid Wire Mike Newton, nScrypt John D. Williams, Ph.D., Boeing Research and Technology Neil Bolding, MacDermid Alpha Electronics Solutions Interconnect Research and Reliability Monday, October 31 Predicting the Saturation of Solder Joint Cycles to Failure with Thermal Cycling Dwell Times Jean-Paul Clech, Ph.D., EPSI Inc. Improved Thermal Fatigue Reliability of SAC305 due to Mixed Metallurgy Assembly with a High-Performance Bi-bearing Solder Paste Richard Coyle, Ph.D., Nokia Bell Labs IPC PERM DoD Phase 3 Test Program: Copper Dissolution Testing Report for Selected Pb-free Solder Alloys: SAC305, SAC4.8Bi, SAC6.0Bi and SAC7.5Bi David Hillman, Collins Aerospace The USPAE Solder Performance and Reliabil- ity Assurance Project: Enabling Pb-free Solder Alloy Use in High Performance Applications David Hillman, Collins Aerospace Thermomechanical Durability Model of 96.5Sn- 3.0Ag-0.5Cu (SAC305) Solder Interconnects in Wafer Level Packaging (WLP) Jean-Baptiste Libot, Safran Electronics & Defense PERM DoD Consortium Phase 3 Pb-free Solder Thermal Cycle Reliability Results Comparing Different Levels of Bismuth Alloying Tim Peason, Collins Aerospace Methodology for Implementation of Pb-free Materials in Aerospace & Defense Electronics Anthony Rafanelli, Ph.D., Raytheon Technologies An Empirical Correlation to Estimate Solder Joint Reliability Acceleration Factors Ross Wilcoxon, Collins Aerospace A Novel Lead-free Lower-temperature Solder Paste for Wafer-level Package Application Hongwen Zhang, Indium Corporation Tuesday, November 1 Experimental Investigation and Phase Field Simulation of Solid-State Diffusion between Cu and Electroplated-Sn System Abhilaash Ajith Kumar, Ph.D., Robert Bosch GmbH Next Generation High Reliability Solder for Enabling Enhanced Thermo-mechanical Performance in Automotive Applications Pritha Choudhury, Ph.D., MacDermid Alpha Electronics Solutions Thermal Fatigue of QFN and Chip Resistor Solder Joints Assembled with SnPb, SAC305, and SnBi Solders Richard Coyle, Ph.D., Nokia Bell Labs Novel Lead-Free Solder Alloys Based on Sn-Ag-Cu-Sb with Enhanced Thermal and Electrical Reliability Jie Geng, Ph.D., Indium Corporation An Examination of Tin Pest Phenomenon over a 10-year Period David Hillman, Collins Aerospace Identification of the Maximum Allowable Compression Load Per Solder Interconnect Tae-Kyu Lee, Ph.D., Cisco Systems