Issue link: https://iconnect007.uberflip.com/i/1480758
OCTOBER 2022 I SMT007 MAGAZINE 59 Thermal Shock Testing of High-reliability Solder Alloys Jayse McLean, John Deere Intelligent Solutions Group Effect of Strain Rate on the Ductility of Bismuth-Containing Solders Keith Sweatman, Nihon Superior Co., Ltd. Impact of High Reliability Pb-free Solder Alloy Assembly with SAC305 Ball Grid Arrays (BGAs) for Thermal Cycle Reliability Tim Pearson, Collins Aerospace Thermal Fatigue Reliability of a 1206 Chip Resistor with High-Performance Pb-free Solder Alloys Tim Pearson, Collins Aerospace Case Study: Metallurgical and Mechanical Analysis of Castellated Via Rigid-Flex Connection Rebecca Wheeling, Ph.D., Sandia National Laboratories Interface Kinetics on Ageing in Indium Interconnect Mechanical Performance with Decreasing Bump Rebecca Wheeling, Ph.D., Sandia National Laboratories Low Temperature Solder Wednesday, November 2 Test Data Requirements for the Acceptance of Low Temperature Solder Alloys Aileen Allen, Insight Global Functional System Observations of Tin-bismuth Low Temperature Solder Electromigration Behavior Kevin Byrd, Intel Corporation Kinetics of the Accumulation of a Layer of Bismuth at the Anode of a Sn-Bi Based Solder Joint During Current Stressing Eric Cotts, Binghamton University Finite Element Analysis of Electromigration Effect on Solder Ball Performance Mehdi Hamid, IBM Corporation Rework Challenges and Solutions on Big and Small Form Factor BGA Packages Using Low Temperature Solder Alloy (LTS) and Tin-Silver-Copper (SnAgCu) Solder Alloy Maria Mejias, Intel Corporation Low Temperature Solder-Surface Mount Manufacturability and Quality Considerations for Ball Grid Array Components Rajen Sidhu, Ph.D., AMD Thursday, November 3 A Review of the Impact of Dopants in Sn-Bi Solder Alloys Aileen Allen, Insight Global The Effect of Thermal Cycling Profile on Thermal Fatigue Performance of a 192-Pin Chip Array BGA with Hybrid, Homogeneous, and Resin Reinforced Low Temperature Solder Interconnects Dan Burkholder, Intel Corporation Thermal Cycling Performance of Hybrid, Homogeneous, and Resin-reinforced Low Temperature Solder Ball Grid Array Interconnects Richard Coyle, Ph.D., Nokia Bell Labs The Thermal Cycling Performance of Hybrid Low Temperature Solder Joints Assembled at Different Peak Reflow Temperatures Richard Coyle, Ph.D., Nokia Bell Labs Thursday, November 3 Addressing Low Temperature Rework Concerns Jennifer Fijalkowski, AIM Solder Microalloying Effects of Sb and Ag on the Microstructural Evolution of Eutectic SnBi Alloys Hannah Fowler, Purdue University