Issue link: https://iconnect007.uberflip.com/i/1480758
60 SMT007 MAGAZINE I OCTOBER 2022 Thermal Reliability of Mixing Bismuth- Containing Solder Paste with SAC BGAs At Low Reflow Temperatures—Part III Wenjing He, Rochester Institute of Technology Low Melting Temperature Solder Interconnect Thermal Cycling Performance Enhancement Using Elemental Tuning Tae-Kyu Lee, Ph.D., Cisco Systems Reliability Performance of Fourth Generation Low Temperature Solder Alloys in Homogeneous and Hybrid Solder Joints Morgana Ribas, MacDermid Alpha Electronics Solutions Low Temperature Solder Hybrid Solder Joint Time Dependent Behavior Learnings Hemant Shah, Ph.D., Intel Corporation Reliability Performance of SMT and Rework Low Temperature Solder Second Level Interconnects Jason Stafford, Intel Corporation Progress Towards Using SAC305-based Super- cooled Liquid Metal Microcapsules to Make Interconnects at LTS Temperatures Ian Tevis, SAFI-Tech, Inc. Reliability of Epoxy-contained Hybrid SnAgCu/ SnBiAg Solder Joint Under Thermal Cycling Test Watson Tseng, Shenmao America, Inc. Materials for Electronics Thursday, November 3 Process and Chemical Reliability Requirements in Matching Reinforcement Materials with Sol- der Paste Flux Residue Westin Bent, MacDermid Alpha Electronics Solutions Conformal Coatings—New Solutions to Existing Problems Christopher Brightwell, Humiseal Europe Die Attach Epoxy Characterization for Electronic Assemblies Deborah Hagen, Sandia National Laboratories Direct Metallization for the Printed Circuit Board Manufacturing Leslie Kim, MacDermid Alpha Electronics Solutions The Effect of EPIG Plating Thicknesses on Solder Joint and Wire Bond Reliability April Labonte, Uyemura International Corp. Evaluation of Reliability Using Sutocatalytic Silver Bath on ENEP Layer Scott Larson, C. Uyemura & Co., Ltd. Creation of a Novel Lead-free Water-soluble Solder Paste that Improves Reliability Through Low Voiding and Ease of Washability Tony Lentz, FCT Solder Engineered Reliability—Safeguarding Electrical Components and Products with Nanocoating Technology Daniel Pulsipher, PhD. HZO The Impact of the Gold Layer Thickness On Layer Properties, Reliability and Solder Wetting Performance of an ENIG Finish Britta Schafsteller, Ph.D., Atotech Deutschland GmbH & Co KG Expandable Bio-based Polymers: A Lightweight Future for Electronics Ruggedization Bethany Turner, MacDermid Alpha Electronics Solutions Increased Reliability of Quad Flat No Lead (QFN) Wettable Flank Connections by Immersion Tin Plating Britta Schafsteller, Ph.D., Atotech Deutschland GmbH & Co KG A Drop-in High-Temperature Lead-Free Solder Paste that Outperforms High-Pb Pastes in Power Discrete Applications Hongwen Zhang, Indium Corporation