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42 SMT007 MAGAZINE I NOVEMBER 2022 Article by Art Wall NEXTFLEX e recent approval of the CHIPS Act has reignited the U.S. semiconductor industry and shone a spotlight on the intricacies involved in chip manufacturing. As new technologi- cal innovations—such as 5G, IoT, AI, automo- tive, and high-performance computing—come to market, they're pushing chip manufactur- ing and integration capabilities. ey demand more performance which leads to added com- plexity in an already extremely complicated process. All this requires a fundamental shi in the way that semiconductors are manufac- tured and integrated. It's no secret that many believe Moore's Law, the standard basis for semiconductor innova- tion over the past 50 years, is reaching the end of its reign. With a need to continue shrink- ing the size of components, engineers are run- ning into roadblocks based on the physical lim- itations of electronics manufacturing, packag- ing, and integration. As manufacturers, we're tasked with finding new ways of improving electronics capabilities, specifically regarding speed and size. One of the key strategic avenues is rethink- ing how we approach the packaging and inte- gration of modern semiconductors. is has implications across the board for chip design, including how they are combined and how they communicate between the chips. Com- Advanced Packaging Gets an Additive Upgrade

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