78 SMT007 MAGAZINE I NOVEMBER 2022
The Electronics Industry's Guide to… The Evolving PCB NPI Process is the first
book in I-Connect007's new The Electronics Industry's Guide to… technical
series. This valuable resource is for all segments of the electronics interconnect
industry. What follows is an excerpt from Chapter 1: How the NPI Process Has
Changed and Where We're Going.
Leaders of top semi-
conductor, microelec-
tronic, IC-Substrate,
PCB, EMS, and OSAT
companies along
with the U.S. govern-
ment and European
Commission gathered in Washington, D.C.
last month to discuss "the next big thing"
in CHIPS Act implementation: expand-
ing "advanced packaging" capacities and
capabilities to go along with expanding
production of semiconductor chips.
Adversity
drives focus,
realization,
and then inno-
vation. This is
especially true
in manufac-
turing, which
has felt the effects of recent challenges. For
decades, manufacturing has been overly
focused on short-term business objectives,
with little regard for risk and adaptability.
Innovators today realize that there is no way
back, that we must embrace the intelligence
that we must have learned.
Book Excerpt: The Electronics Industry's Guide to…
The Evolving PCB NPI Process
CHIPS Act Implementation
Requires Strong Focus on
'Advanced Packaging,'
Industry Leaders Say
Smart Factory Insights: The
Progress of Machine Intelligence
TOP TEN
EDITOR'S
PICKS
IPC Releases EMS Industry Results for
September 2022
BANNOCKBURN, Ill., USA, October 27, 2022 —
IPC announced today the September 2022
findings from its North American Electronics
Manufacturing Services (EMS) Statistical
Program. The book-to-bill ratio stands at 1.29.
North American EMS Industry
Up 15.5 Percent in September
