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78 SMT007 MAGAZINE I NOVEMBER 2022 The Electronics Industry's Guide to… The Evolving PCB NPI Process is the first book in I-Connect007's new The Electronics Industry's Guide to… technical series. This valuable resource is for all segments of the electronics interconnect industry. What follows is an excerpt from Chapter 1: How the NPI Process Has Changed and Where We're Going. Leaders of top semi- conductor, microelec- tronic, IC-Substrate, PCB, EMS, and OSAT companies along with the U.S. govern- ment and European Commission gathered in Washington, D.C. last month to discuss "the next big thing" in CHIPS Act implementation: expand- ing "advanced packaging" capacities and capabilities to go along with expanding production of semiconductor chips. Adversity drives focus, realization, and then inno- vation. This is especially true in manufac- turing, which has felt the effects of recent challenges. For decades, manufacturing has been overly focused on short-term business objectives, with little regard for risk and adaptability. Innovators today realize that there is no way back, that we must embrace the intelligence that we must have learned. Book Excerpt: The Electronics Industry's Guide to… The Evolving PCB NPI Process CHIPS Act Implementation Requires Strong Focus on 'Advanced Packaging,' Industry Leaders Say Smart Factory Insights: The Progress of Machine Intelligence TOP TEN EDITOR'S PICKS IPC Releases EMS Industry Results for September 2022 BANNOCKBURN, Ill., USA, October 27, 2022 — IPC announced today the September 2022 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.29. North American EMS Industry Up 15.5 Percent in September

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