Issue link: https://iconnect007.uberflip.com/i/1483130
46 SMT007 MAGAZINE I NOVEMBER 2022 solution for the right applications. High-fre- quency applications are already taking advan- tage in some cases of chip stacking to improve both performance and miniaturization. Additive Processing Applied to Printed Circuit Boards That Can Also Be Flexible It's easy to see the impact the inclusion of additive processes for electronic interconnects can play in advanced packaging, but this can also extend beyond and serve as an alternative to traditional PCB manufacturing. is would again take advantage of the faster and lower cost these methods provide. Much of the materials, process, and tool- ing development in additive electronics comes from a technology referred to as flexible hybrid electronics (FHE). is is a concept where the circuit board is additively printed on a low cost, flexible substrate and bare, unpackaged, thin, flexible chips are directly integrated onto the printed traces. Flexible electronics have many applications such as medical wearable devices, asset monitoring, so robotics, and more. Not only does this mean that electronic systems can be made flexible, but it also leads to a sub- stantial reduction in weight, which is critically important in applications such as automotive and aerospace. e opportunities for what we can achieve in the development of chip manufacturing and traditional PCB processes following the sign- ing of the CHIPS Act feel limitless. With this large emphasis placed on the role electronics play in our daily lives, we can begin innovating in new areas of the process, such as advanced packaging, and implement the benefits of addi- tive techniques. e simplification of electronic board man- ufacturing has the potential to revolutionize PCB manufacturing while also continuing to impact the advanced packaging process. We just have to take the first steps to meet the advanced needs of incoming innovations. SMT007 Art Wall is director of fab operations at NextFlex. Art Wall