Design007 Magazine

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• Design007 Magazine — December 2022
• Feature Contents — A Show Within a Show
• Additional Contents
• Column — Design at IPC APEX EXPO 2023: A Show Within a Show
• Feature Interview — A New Gathering Place for Designers
• Short — Kulicke & Soffa Extends Advanced Packaging Leadership
• Feature Interview — The Battle of the Boards
• Article — Where Exactly IS the Signal?
• Short — New Standard Chip-Scale Laser Isolator Could Transform Photonics
• MilAero007 Highlights
• Column — The Recipe for Customer Service Success
• Feature Interview — Designing a Sustainable Future
• Column — Green Coates Are In
• Short — Lam Research Acquires SEMSYSCO to Advance Chip Packaging
• Q&A — A Sneak Peek With Jim van den Hogen
• Q&A — Workflow Challenges in Fabrication
• Column — Optimum Thermal Stability Considerations
• Q&A — Altium Focuses on Design Education
• Interview — ICAPE: Solutions With No Limits
• Article — DFM 101—Final Finishes: Electrolytic Nickel/Gold
• Flex007 Highlights
• Column — Flexible Circuits and In-line SMT Assembly Processing
• Column — A Primer on Flexible Circuits in Printed Electronics
• Column — Flexible Circuits: A Road Less Traveled
• Short — Changing Color of Quantum Light on an IC
• Top Ten Editor's Picks
• Career Opportunities section
• Educational Resources
• Advertiser Index and Masthead