SMT007 Magazine

JANUARY 2023 I SMT007 MAGAZINE 43 Figure 3: Migration towards chiplet architecture. Figure 2. Semiconductor Nodes e 7 nm node is in mass production and 5 nm nodes have been introduced for some of the latest processors. e industry is on the way to introducing 3nm nodes. Samsung has provided some details of its 3 nm develop- ment plans. TSMC is in production with 5 nm semiconductor technology, shipping applica- tion processors for Apple's iPhones. TSMC is working on 3 nm and 2 nm nodes. IBM has announced the development of a 2 nm chip, based on gate-all-around FET. Intel indicates it is working on advanced processes and has announced plans for Intel 7 in 2021, Intel 4 for

• SMT007 Magazine — January 2023
• Featured Content — The Impact of Advanced Packaging
• Additional Content
• Column — Advanced Packaging
• Column — Creating a Better World Through Engineering
• Feature Interview — The Nuts and Bolts of Advanced Packaging
• Short — Novel Multi-Proton Carrier Complex as Efficient Proton Conductor at High Temperatures
• Feature Article — Advanced Packaging Beyond the Zetabyte Era
• Short — NIST Resources for CHIPS Act Participants
• Column — An Unblinkered View
• Feature Article — Key Findings From Semiconductor Fabrication Research
• Short — Shrinking Qubits for Quantum Computing With Atom-thin Materials
• MilAero007 Highlights
• Article — A CMMC 'Plan B'
• Feature Article — Integra: Redefining Die Prep in the U.S.
• Column — Fair and Square
• Feature Article — Durability and Cost Benefits Drive Mil-Aero Demand for OCPP
• Special Section — The Top 5 Things You Need to Know About
• Top 5 Things: Blackfox Training
• Top 5 Things: Burkle North America
• Top 5 Things: Mycronic
• Top 5 Things: Taiyo America
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