Issue link: https://iconnect007.uberflip.com/i/1489778
JANUARY 2023 I DESIGN007 MAGAZINE 9 Chris Hunrath discusses the use of films and resin systems for high-reliability and advanced technology designs. Ashutosh Mauskar breaks down the nearly "perfect storm" of drivers affecting the semiconductor industry and pack- aging trends, including supply chain issues, artificial intelligence, EVs and autonomous vehicles. And columnist John Watson explains why packaging is likely to continue shrinking and pushing Moore's Law to its limits: "We are simply running out of room." We have columns from our regular contribu- tors Barry Olney, Matt Stevenson, Joe Fjels- tad, Anaya Vardya, and Saskia Hogan, as well as an article from Zachariah Peterson and an interview with Ventec's Alun Morgan and Mark Goodwin. I hope you all had a great New Year's cel- ebration, and that 2023 is better than 2022. We'll be covering IPC APEX EXPO and DesignCon soon. I look forward to seeing you on the road. DESIGN007 Andy Shaughnessy is managing editor of Design007 Magazine. He has been covering PCB design for 23 years. To read past columns, click here. Yes, even the definition of advanced packag- ing is, well, advanced. Every step of the design cycle is a potential trade-off that must be man- aged when working with non-standard PCBs. As we'll see with this month's features, the needs of the PCB designers and the design- ers of chips and packages are beginning to converge, and PCB designers now find them- selves learning about chiplets and 3D-IC tech- nologies. Will PCB designers of the future be experts at silicon interposer design? We asked a variety of experts to discuss the challenges and opportunities that PCB design- ers and design engineers are seeing today with advanced packages, as well as trade-offs. is issue leads with an article by Kris Moyer, who focuses on the routing tech- niques necessitated by advanced packaging. Next, Lee Ritchey discusses a challenge that's facing aerospace PCB designers who use stacked microvias, and he offers a variety of methods for circumventing this problem, including using staggered microvias. Colum- nist Tim Haag shares his take on designing complex packaging, and he tracks how com- plicated some designs have become over the past few decades.