PCB007 Magazine

PCB007-Mar2023

Issue link: https://iconnect007.uberflip.com/i/1494936

Contents of this Issue

Navigation

Page 96 of 111

MARCH 2023 I PCB007 MAGAZINE 97 In his State of the Union address in early Febru- ary, President Biden departed from his usual topics about education and the economy to mention the new CHIPS Act, as well as supply chain and infra- structure issues. For perspective on those remarks, Nolan Johnson chats with David Schild, executive director of the Printed Circuit Board Association of America (PCBAA). Coreen Blaylock, recipient of the IPC Excellence in Education Award, is in project management and ping opera- tions at Lockheed Martin. She shares her unconventional introduction to the industry and how her work in STEM education and building industry partnerships has been instrumental in reinvig- orating the manufacturing workforce. APCT, a designer and custom manufac- turer of advanced technology printed circuit boards, has completed the previ- ously announced acquisition and merger with Advanced Circuits, Inc., and its affiliated entities and subsidiaries. The main task of the final finish is to protect the copper pad from tarnishing or oxidation while simultaneously keeping the surface active for the assembly. Electroless nickel/ immersion gold (ENIG) is a widely accepted finish in the market that provides a good solderability and capability for Al-wire bonding. A main function of the gold layer is to prevent the oxidation of the nickel layer. TTM Technologies, Inc., a leading global manufacturer of technology solutions, including engineered systems, radio frequency (RF) components and RF microwave/micro- electronic assemblies and printed circuit boards (PCBs), announced that it plans to close three manufacturing facil- ities in order to improve total plant utilization, operational performance, customer focus and profitability. John Ekis, market segment director, Aerospace and Defense, Rogers Corporation, discusses with Pete Starkey the importance of close applications engineering relationships in understanding and responding to the requirements and challenges of specialist new product development. For the latest news and information, visit PCB007.com Coreen Blaylock: Opening Doors for New Professionals TTM Technologies Announces Consolidation of Manufacturing Footprint Why Gold Layer Thickness in ENIG Matters for Soldering Real Time with... IPC APEX EXPO 2023: Challenges of New Product Development Time to 'Finish the Job' on PCB Funding APCT Completes the Acquisition and Merger with Advanced Circuits Dr. Britta Schafsteller

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB007-Mar2023