96 PCB007 MAGAZINE I MARCH 2023
The last three years have
been a challenge, from
the pandemic to the
circus of shenanigans in
Washington, neither of
which have been pleas-
ant. So, it's not hard to
figure out why we are all in this current
situation. We're not quite in a recession
but rather a stagnation. The winds of
change have come, but many are still
Wilson looking over "Tool Time" Tim's fence
to see what he is going to do. It's time to go
back to our sheds and sharpen the saw.
The EIPC Winter
Conference
returned to the
Metropolis of Lyon
in eastern France
this month. In 2018, the venue was Villeurbanne
in the Auvergne-Rhône-Alpes region. Five years
later the setting was the Groupama Stadium in
Décines-Charpieu, and leaders of the European
printed circuit community gathered in expectation
of a spectacular programme of 16 presentations,
a visit to a nuclear power station, and an
invaluable networking opportunity. They
weren't disappointed.
The November issue of PCB007 Magazine included a fair amount of
discussion on the growing need for ultra-high density interconnects
(UHDI). UHDI is an area replete with manufacturing challenges due not
only to the feature sizes this technology requires (< 50 micron or < 2
mils), but also the lack of familiarity U.S. manufacturers have with this
technology. In an interview with Calumet's Todd Brassard and Meredith
LaBeau, they stated that the U.S. is roughly 30 years behind the curve
in manufacturing UHDI, which is likely the result of companies offshor-
ing UHDI manufacturing for many years. How can we catch back up?
One World, One Industry: Advanced Packaging
Year in Review
Over the past year, IPC has stepped up its efforts to educate policymakers
and other key audiences on the importance of investing in the entire semi-
conductor supply chain to achieve the goals of the CHIPS and Science Act,
including in advanced packaging and printed circuit boards. Our message
to policymakers is that building a more robust, domestic ecosystem for
advanced electronics will require four key policy decisions.
EIPC Winter Conference 2023:
Day 1 Review
Testing Todd: Turning Into
the Wind
The Chemical Connection: The Subtractive Vision
TOP TEN
EDITOR'S
PICKS
