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Design007-Apr2023

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34 DESIGN007 MAGAZINE I APRIL 2023 reduce as the electromagnetic wave enters the SIW. Here the field becomes more intense and less distributed, providing clarity of signal and thus higher bandwidth. Obviously, another similar transition back to the microstrip, at the other end to receive the signal, is also required. e downside, of this configuration, is the dis- tortion of the field—limiting bandwidth—at the transition from the microstrip to the SIW. While it is relatively simple to interface SIW with microstrip lines, in order to exploit con- nectivity to surface-mount devices, CPW tech- nology is more amenable to integration with leadless monolithic microwave integrated cir- cuits (MMIC). An MMIC is a device that oper- ates at µWave frequencies and typically per- forms functions such as µWave mixing, power amplification, low-noise amplification, and high-frequency switching. Figure 4 illustrates a back-to-back CPW grounded to SIW struc- ture. Ultra-low loss RT/Duriod 5880 dielec- tric is used for the core material. e transi- Figure 3: Microstrip-to-SIW transition and simulated electric field. (Source: Kumar 3 ) Figure 4: Back-to-back CPWG to SIW. (Source: Taringou 4 and iCD CPW Planner)

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