IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1497169
Koh Young is delivering solutions to increase production efficiency with measurement-based inspection for boards with a mix of component types. The Zenith and KY-P3 product offerings provide automated back-end solutions that combine advanced optics and innovative Al-powered vision algorithms for through-hole leads and pins, as well as traditional su ace mount components on the same assembly. pically, manufacturers required two separate machines for surface mount and through-hole inspection, but the updates to our best-in class Zenith and KY-P3 machines afford mixed technology capabilities that reduces capital investments by delivering machines capable of both su ace mount components and through-hole leads and pins. T he traditional surface mount components and through-hole leads and pins are inspected with our multi-projection Moire inte erometry system. With proprietary, Al-powered algorithms for blow or pin holes, solder volume, bridging, insufficient, excessive, solder balls, and solder fillet, missing or offset pin, pin height, polarity, plus foreign material, the machines are more powe ul than ever. When considering pin inspection challenges, the KY-P3 addresses single, array, press-fit, and fork arrangements, as well as pins within a connector shroud, inner and outer wall distances, fork pin separation, and paste height measurement to help manufacturers increase yields. - 470-374-9254 e america@kohyoung.com kohyoungamerica.com 00®00 zenlTH UHS KOHYOUNG Incorporating the world's first True3D'" quad-projection probe, the systems deliver shadow-free measurement with low false calls. Additionally, the "Stop-and-Go" probe movement allows it to capture 3D measurement data without system vibration, image stitching, or data interpolation. T he machines deliver True3D'" measurement capabilities for automotive electronic control units (ECMs), industrial products, and computer boards, as well as backplane and connector assemblies. Its quantitative True3D'" measurement-based approach delivers best-in-class accuracy and repeatability for electronics manufacturers. - - • Algorithms for Blow or Pin Holes, Bridging, Insufficient, Excessive, Volume, Solder Balls, and Solder Fillet, Missing or Offset Pin, Pin Height, Volume, Polarity, plus Foreign Material and Debris • Suitable for Pin in Paste, wave, and selective • Dual Side Inspection with Integrated Flipper • 70mm extended clearance • Versatile substrate and carrier handling systems • Automated back-end THT inspection solution