Issue link: https://iconnect007.uberflip.com/i/1498238
42 SMT007 MAGAZINE I MAY 2023 longer open book test. One of the typ- i c a l p r o b l e m s o n the open book test is oen to design an SMT assembly line that will produce a cer tain amount of PCB assemblies in a year. e line should have the lowest cost, g i v e n a c h o i c e o f equipment presented in the problem. Alge- bra and considerable ar ithmetic calcula- t i o n s a r e r e q u i r e d for this problem. e candidates may use a calculator or Excel, if desired. Oen, another type of problem is match- ing a reflow profile to a solder paste specifi- cation (Figures 1 and 2). Can you solve this problem? When you get an answer, send an email to rlasky@ indium.com and I will tell you if you are correct. Ab out 80-90% of c a n d i d a t e s w h o t a k e t h e t e s t s a c h i e v e a p a s s i n g g r a d e o f 7 0 % o r m o r e . T h o s e who become certified are justly proud of b e c o m i n g a n S M TA C e r t i f i e d P r o c e s s Engineer. SMT007 Dr. Ronald C. Lasky is an instruc- tional professor of engineering for the Thayer School of Engineering at Dartmouth College, and senior technologist at Indium Corporation. Figure 2: A reflow temperature profile. Figure 1: A solder paste recommended reflow temperature profile. (Source: Indium) Workshops are given multiple times throughout the year. If you are interested in becoming an SMTA Certified Process Engineer, visit this site (smta.org/page/ certification) to find the dates and locations of future workshops. I would be pleased to answer any questions about this important program.