74 SMT007 MAGAZINE I JUNE 2023
One of today's biggest challenges is finding, hiring, and retaining good and
solid employees. Some people blame the times, while others blame the
workforce, especially millennials. If that's the way you want to go, then fine,
but I must warn you that with that mindset, you will never find what you're
looking for. Instead, let's shift the paradigm and become better ambassadors
for our industry.
Now available on
Spotify, Episode 2 of
I-Connect007's new
podcast, On the Line
with… features an
interview with Susan
Kayesar of Siemens.
Kayesar addresses
cloud applications
and sustainability,
as well as some key, new best practices that
emerge from using a cloud-based platform
for business operations software systems.
Package-on-package
(PoP) is an electronic
component-stacked
package type consisting
of vertically stacked
ball grid arrays most
commonly in a two-high stack. The package
closest to the board is the logic/CPU com-
ponent and is more commonly known as the
"bottom" package. The "top" package sits
on top of this module and is the memory
module. These packages are generally
found in consumer electronics (mobile
devices) such as smartphones, tablets, and
netbooks. These packages tend to be high
IO count, fine pitch, very thin packages.
Standard of Excellence: Hey World, Our Products Matter
Sustainability Podcast: Episode 2,
'Sustainability Through Cloud
Applications', Now Available
Knocking Down the Bone Pile:
Package on Package Rework—
Skill Required
TOP TEN
EDITOR'S
PICKS
At the recent SMTA Boise Expo & Tech Forum, Barry Matties spoke
with Doug Holtz, national sales manager of Conductive Containers,
about challenges related to ESD and where manufacturers are most
vulnerable. It's a growing concern, Doug says, and there are impor-
tant lessons to be learned. Doug also reviews his presentation, and he
points out how reducing touchpoints in the supply chain can make a
world of difference for both customers and manufacturers.
Taking Charge of ESD
Anaya Vardya
Susan Kayesar
Doug Holtz
