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if not managed well, may lead to manufactur- ing issues or field failures. NextFlex Calls for 3D Imaging Technology Proposals E Nolan Johnson talks with Scott Miller about a special "Open Project" call for proposals which NextFlex currently is exploring for methods to dewarp 3D scans of physical boards to enable multi-image scans to be stitched together. ere is the possibility of funding for viable proposals. SEMI Flextech Invites Proposals for Flexible Hybrid Electronics Innovations E FlexTech has issued a request for proposals (RFP) for advances in materials, FHE design tools, additive-enabled processing, hybrid electronics packaging, FHE manufacturing, AI/ML applications, so robotics, and power solutions. Selected projects will receive cash awards ranging from $250,000 to $1 million. e program is funded by the Army Research Laboratory (ARL). New Flex Circuits Guide Now Available From American Standard Circuits E I-Connect007 and American Standard Circuits are proud to announce the launch of the com- panion guide to the immensely popular book, The Printed Circuit Designer's Guide to... Flex and Rigid-flex Fundamentals. This short guide is designed to provide additional insights and best practices for those who design or manu- facture flex and/or rigid-flex circuit boards. Download your free copy today at: I-007ebooks. Flexible Printed Circuit Boards Market to Reach $20B by 2029 E Maximize Market Research has published a competitive intelligence and market research report on the "Flexible Printed Circuit Boards Market." The total Flexible Printed Circuit Boards Market revenue is expected to grow at a CAGR of 10.725 percent from 2023 to 2029, reaching USD 40.81 billion during the forecast period. Selecting Flex Materials: Do Your Homework E While the layout of the circuit gives us much of the electrical characteristics of the design, your choice of materials can affect the mechan- ical and electrical characteristics of the circuit. Material choices affect not only the design of the circuit for its environment, but also the manufacturing and assembly processes. Challenges of DFM Analysis for Flex and Rigid-flex Design, Part 2 E While less common in rigid PCBs, flexible PCBs have many inter-layer dependencies that, 66 DESIGN007 MAGAZINE I JUNE 2023

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