if not managed well, may lead to manufactur-
ing issues or field failures.
NextFlex Calls for 3D Imaging
Technology Proposals E
Nolan Johnson talks with Scott Miller about a
special "Open Project" call for proposals which
NextFlex currently is exploring for methods to
dewarp 3D scans of physical boards to enable
multi-image scans to be stitched together.
ere is the possibility of funding for viable
proposals.
SEMI Flextech Invites Proposals
for Flexible Hybrid Electronics
Innovations E
FlexTech has issued a request for proposals
(RFP) for advances in materials, FHE design
tools, additive-enabled processing, hybrid
electronics packaging, FHE manufacturing,
AI/ML applications, so robotics, and power
solutions. Selected projects will receive cash
awards ranging from $250,000 to $1 million.
e program is funded by the Army Research
Laboratory (ARL).
New Flex Circuits Guide Now Available
From American Standard Circuits E
I-Connect007 and American Standard Circuits
are proud to announce the launch of the com-
panion guide to the immensely popular book,
The Printed Circuit Designer's Guide to... Flex
and Rigid-flex Fundamentals. This short guide
is designed to provide additional insights and
best practices for those who design or manu-
facture flex and/or rigid-flex circuit boards.
Download your free copy today at: I-007ebooks.
Flexible Printed Circuit Boards Market
to Reach $20B by 2029 E
Maximize Market Research has published a
competitive intelligence and market research
report on the "Flexible Printed Circuit Boards
Market." The total Flexible Printed Circuit
Boards Market revenue is expected to grow at
a CAGR of 10.725 percent from 2023 to 2029,
reaching USD 40.81 billion during the forecast
period.
Selecting Flex Materials:
Do Your Homework E
While the layout of the circuit gives us much
of the electrical characteristics of the design,
your choice of materials can affect the mechan-
ical and electrical characteristics of the circuit.
Material choices affect not only the design of
the circuit for its environment, but also the
manufacturing and assembly processes.
Challenges of DFM Analysis for Flex
and Rigid-flex Design, Part 2 E
While less common in rigid PCBs, flexible
PCBs have many inter-layer dependencies that,
66 DESIGN007 MAGAZINE I JUNE 2023
