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JUNE 2023 I PCB007 MAGAZINE 73 nickel corrosion and maintained excellent wet- tability during soldering. Nickel corrosion was evaluated using the method specified in IPC- 4552B. Wetting balance was used to evaluate wettability. e data shows that the use of RAIG in place of immersion gold yielded a reproducible thickness of 8.0 µins of gold, on top of the pal- ladium and nickel. ickness data came from 20 different pads (60 x 176 mil). e added gold thickness enhances the gold wire bonding ability of the ENEPIG surface, as it widens the operating window of the bonding parameters. Corrosion evaluation was done by follow- ing the method outlined in IPC-4552B, ENIG Specification. Cross-sections in Figure 3 from different locations were evaluated at 1000x magnification and were examined for any cor- rosion spikes. e micrographs show "zero" corrosion level. Figure 3: Corrosion evaluation per IPC-4552B, ENIG Specification. Figure 4: The results of wetting balance per J-STD-003C, WAM2, 2x reflow.