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74 PCB007 MAGAZINE I JUNE 2023 Solderability was evaluated per JSTD-003C WAM 1&2 Specification. Wetting balance Time (≤ 2.5 seconds) = Avg. is 2.25 seconds, Pass. Wetting balance Force (> 0.17mN/mm) = Avg. is 0.22 mN/mm, Pass. e thicker gold layer meets J-STD-003C WAM1&2 specification and shows no evidence of non-wetting or de-wetting. e use of RAIG in place of standard im- mersion gold will allow for the deposition of a thicker gold layer, thus overcoming the limi- tations of immersion gold on palladium. e RAIG thicker gold layer had no adverse ef- fects on solderability. An added benefit to the use of RAIG is that the probability of nickel corrosion under the palladium layer is elimi- nated. PCB007 George Milad is the national accounts manager for technol- ogy at Uyemura. To read past columns, click here. Figure 5: Edge dip per J-STD-003C, WAM2.